0,635 0,025 ident. nr. part no. note 2: rohs compliant [in] 30in au over 50inni round wire contacts note 1: panel ground flanges top, sides and bottom (gf5) termination zone 133776 contact finish index date c 19.08.2008 6 1 recommended pcb layout (component side view) empfohlenes leiterplatten-layout (bestueckungsseite) tol. 0.05 [0.002] unless noted 2,54 0,100 x2 0,07 1,60 3,25 0,07 0,063 0,003 0,400 10,16 0,003 0,128 0,531 13,5 0,100 2,54 0,050 1,27 0,120 3,05 x2 8,89 0,350 0,89 0,07 x6 0,035 0,003 0,429 0,008 10,89 0,20 3,05 0,120 0,537 13,63 0,850 0,20 0,012 - 0,008 + 21,60 -0,30 + 3,50 0,20 0,138 0,008 1 6 0,547 0,25 0,010 - 0,010 + 13,90 -0,25 + 10,16 0,13 0,400 0,005 standoff abstand proprietary notice pursuant to iso 16016 to be observed. mj 6p6c, 1x1, shielded mod jack 133776 2:1 information: tolerances scale all dimensions in mm designation contact one of the erni companies a3 drawing will not be updated. prior notice. subject to modification without class www.erni.com before using. all rights reserved. only for information. to insure that this is the latest version of this drawing, please copyright by erni gmbh i (1/1) 1:1 top of pcb lp recommended panel cutout empfohlener frontplatten-ausschnitt 0,606 0,30 15,39 0,10 max 0,004 0,012 14,07 0,20 0,554 0,008 technical specifications materials & finish standard applic. value test data standard applic. value insulation body standard description pbt 30% mechanical properties contact material standard description cusn5 insertion/withdrawal force iec 603-7 max. 20 n contact finish, mating zone thickness of plating 30 in au over 50 in ni mechanical operations iec 512-5, 9a min. 1.000 contact finish termination zone thickness of plating 30 in au over 50 in ni effectiveness of connector shell/shield material standard description c2680 (acc. jis) coupling device iec 512-8, 15f 50 n shell/shield plating thickness of plating 50 in ni electrical properties creepage / clearance distances assembly process a) contact - contact iec 807-3 0,57 mm packaging tray b) contact - shell iec 807-3 min. 1,0 mm solder temperature 235c at 3-5s voltage proof (dielectric withstand voltage) suitable assembly process wave a) contact - contact iec 512-2, 4a min. 1.000 v ac/dc b) contact - shell/testpanel iec 512-2, 4a min. 1.500 v ac/dc approvals current carrying capacity iec 512-3, 5b 1,5 a @ 25 c ul insulation body ul 94 v0 contact resistance iec 512-2, 2a max. 30 mohm ul file no. e145613 insulation resistance iec 512-2, 3a min. 500 mohm rohs compliant yes environmental properties operation temperature 0 - 70 c
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